JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced that its JC-15 Committee for Thermal Characterization Techniques for Semiconductor Packages welcomes interested companies to join JEDEC and participate in committee meetings and activities. Near-term plans for the committee include the evolution of standards that cover the provision of electronic thermal models in neutral file formats (e.g. JEP181, JEP30 T101), as well as the review and improvement of several key standards previously developed by the committee. For more information about JC-15 activities and JEDEC membership visit the JEDEC website.

Activities within JC-15’s scope include the standardization of thermal characterization techniques, both testing and modeling, for electronic packages, components, and materials for semiconductor devices.

“The activities of JC-15 reflect JEDEC’s commitment to evolving alongside the dynamic microelectronics industry,” said Robin Bornoff, Acting Chair of the JC-15 Committee. He added, “The wide range of subjects covered by JC-15 standards provides our members with diverse opportunities to contribute their knowledge and expertise to further enhance the efficacy of the electronics thermal supply chain.”

About JEDEC

JEDEC is the global leader in the development of standards for the microelectronics industry. Thousands of volunteers representing over 350 member companies work together in more than 100 JEDEC committees and task groups to meet the needs of every segment of the industry, for manufacturers and consumers alike. The publications and standards generated by JEDEC committees are accepted throughout the world. All JEDEC standards are available for download from the JEDEC website. For more information, visit https://www.jedec.org.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240731030430/en/